Inventor
ESKILDSEN STEVEN R
US11 patents
⚠️ This page may combine multiple inventors who share the name “ESKILDSEN STEVEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS6605875B2Aug 12, 2003
Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
INTEL CORP74 citations95
US6704204B1Mar 9, 2004
IC package with edge connect contacts
INTEL CORP37 citations89
US6547570B2Apr 15, 2003
IC package with quick connect feature
INTEL CORP18 citations89
US6489557B2Dec 3, 2002
Implementing micro BGA™ assembly techniques for small die
INTEL CORP34 citations89
US5336456AAug 9, 1994
Method of producing a scribelined layout structure for plastic encapsulated circuits
INTEL CORP20 citations87
US6356456B2Mar 12, 2002
Low pin count card retainer
INTEL CORP16 citations83
US7533457B2May 19, 2009
Packaging method for circuit board
INTEL CORP7 citations71
US6655022B1Dec 2, 2003
Implementing micro BGA assembly techniques for small die
INTEL CORP11 citations70
US6250934B1Jun 26, 2001
IC package with quick connect feature
INTEL CORP8 citations70
US7823279B2Nov 2, 2010
Method for using an in package power supply to supply power to an integrated circuit and to a component
INTEL CORP1 citations51