Inventor
CHA YONG-WON
KR12 patents
⚠️ This page may combine multiple inventors who share the name “CHA YONG-WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7033908B2Apr 25, 2006
Methods of forming integrated circuit devices including insulation layers
SAMSUNG ELECTRONICS CO LTD49 citations92
US7332409B2Feb 19, 2008
Methods of forming trench isolation layers using high density plasma chemical vapor deposition
SAMSUNG ELECTRONICS CO LTD13 citations82
US7781302B2Aug 24, 2010
Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions
SAMSUNG ELECTRONICS CO LTD3 citations62
US7560383B2Jul 14, 2009
Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7598177B2Oct 6, 2009
Methods of filling trenches using high-density plasma deposition (HDP)
SAMSUNG ELECTRONICS CO LTD2 citations61
US7056827B2Jun 6, 2006
Methods of filling trenches using high-density plasma deposition (HDP)
SAMSUNG ELECTRONICS CO LTD3 citations61
US7605022B2Oct 20, 2009
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
SAMSUNG ELECTRONICS CO LTD4 citations59
US7470603B2Dec 30, 2008
Methods of fabricating semiconductor devices having laser-formed single crystalline active structures
SAMSUNG ELECTRONICS CO LTD1 citations52