Inventor
WENG GWO-LIANG
TW19 patents
Patents
19 patentsUS7061079B2Jun 13, 2006
Chip package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG144 citations98
US7589408B2Sep 15, 2009
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG59 citations97
US7550832B2Jun 23, 2009
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG56 citations97
US7642133B2Jan 5, 2010
Method of making a semiconductor package and method of making a semiconductor device
ADVANCED SEMICONDUCTOR ENG183 citations96
US7365427B2Apr 29, 2008
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG43 citations92
US7187070B2Mar 6, 2007
Stacked package module
ADVANCED SEMICONDUCTOR ENG22 citations92
US6815833B2Nov 9, 2004
Flip chip package
ADVANCED SEMICONDUCTOR ENG33 citations92
US7187067B2Mar 6, 2007
Sensor chip packaging structure
ADVANCED SEMICONDUCTOR ENG34 citations90
US6257857B1Jul 10, 2001
Molding apparatus for flexible substrate based package
ADVANCED SEMICONDUCTOR ENG15 citations84
US7122893B2Oct 17, 2006
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG16 citations83
US6465277B2Oct 15, 2002
Molding apparatus and molding method for flexible substrate based package
ADVANCED SEMICONDUCTOR ENG7 citations74
US7547962B2Jun 16, 2009
Chip package with a ring having a buffer groove that surrounds the active region of a chip
ADVANCED SEMICONDUCTOR ENG4 citations62
US7193282B2Mar 20, 2007
Contact sensor package
ADVANCED SEMICONDUCTOR ENG3 citations62
US7442580B2Oct 28, 2008
Manufacturing method of a package structure
ADVANCED SEMICONDUCTOR ENG0 citations52
US7439619B2Oct 21, 2008
Electronic package structure and the packaging process thereof
ADVANCED SEMICONDUCTOR ENG0 citations52
US7989937B2Aug 2, 2011
Package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations51
US7195956B2Mar 27, 2007
Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
ADVANCED SEMICONDUCTOR ENG0 citations51
US7126221B2Oct 24, 2006
Semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations51
US7432127B2Oct 7, 2008
Chip package and package process thereof
ADVANCED SEMICONDUCTOR ENG0 citations50