Inventor
HO MING LUN
US6 patents
⚠️ This page may combine multiple inventors who share the name “HO MING LUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
5 patentsUS7019407B2Mar 28, 2006
Flip chip package structure
ADVANCED SEMICONDUCTOR ENG31 citations92
US7291924B2Nov 6, 2007
Flip chip stacked package
ADVANCED SEMICONDUCTOR ENG23 citations91
US7002246B2Feb 21, 2006
Chip package structure with dual heat sinks
ADVANCED SEMICONDUCTOR ENG29 citations91
US7098071B2Aug 29, 2006
Method for flip chip bonding by utilizing an interposer with embedded bumps
ADVANCED SEMICONDUCTOR ENG5 citations61
US7220619B2May 22, 2007
Process of cutting electronic package
ADVANCED SEMICONDUCTOR ENG1 citations41