Inventor
IWASE TEPPEI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “IWASE TEPPEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC CORP
6 patentsUS7904281B2Mar 8, 2011
Mounting process simulation system and method thereof
PANASONIC CORP5 citations62
US9136219B2Sep 15, 2015
Expanded semiconductor chip and semiconductor device
PANASONIC CORP2 citations60
US7873932B2Jan 18, 2011
Method for analyzing component mounting board
PANASONIC CORP2 citations59
US8766418B2Jul 1, 2014
Semiconductor device
PANASONIC CORP1 citations51
US7994638B2Aug 9, 2011
Semiconductor chip and semiconductor device
PANASONIC CORP0 citations51
US8050049B2Nov 1, 2011
Semiconductor device
PANASONIC CORP0 citations50
PANASONIC IP MAN CO LTD
4 patentsUS9950463B2Apr 24, 2018
Imprinting device
PANASONIC IP MAN CO LTD1 citations51
US10578775B2Mar 3, 2020
Film structural member
PANASONIC IP MAN CO LTD0 citations49
US10866509B2Dec 15, 2020
Mold, imprint device, and imprint method
PANASONIC IP MAN CO LTD0 citations47
US10105874B2Oct 23, 2018
Imprinting method and imprinting device
PANASONIC IP MAN CO LTD0 citations41
IWASE TEPPEI
3 patentsUS8426965B2Apr 23, 2013
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
IWASE TEPPEI2 citations60
US8264079B2Sep 11, 2012
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
IWASE TEPPEI3 citations60
US8106521B2Jan 31, 2012
Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
IWASE TEPPEI4 citations60