Inventor

BEMMERL THOMAS

DE29 patents

⚠️ This page may combine multiple inventors who share the name “BEMMERL THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BEMMERL THOMAS

INFINEON TECHNOLOGIES AG

Electronic component and semiconductor wafer, and method for producing the same

Electronic package having integrated cooling element with clearance for engaging package

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Electronic device

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device with semiconductor device components embedded in a plastics composition

Electronic devices including vent openings and associated methods

Semiconductor package and clip with a die attach

Semiconductor device comprising a composite material clip

Semiconductor device with integrated shunt resistor

Semiconductor package system

Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof

Support with solder ball elements and a method for populating substrates with solder balls

Semiconductor package with space efficient lead and die pad design

Electronic device

Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package

Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier

Multichip power semiconductor device

Panel and semiconductor device having a composite plate with semiconductor chips

Package with elevated lead and structure extending vertically from encapsulant bottom

Semiconductor package and method for producing the same

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

BEMMERL THOMAS

Electronic arrangement and method for producing an electronic arrangement

Lens, optoelectronic component comprising a lens and method for producing a lens

INFINEON TECHNOLOGIES AUSTRIA AG

Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw

Semiconductor device package comprising a pin in the form of a drilling screw

MAHLER JOACHIM

Multichip power semiconductor device

OSRAM OPTO SEMICONDUCTORS GMBH

Electronic arrangement

PREUSS STEPHAN

Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer