Inventor

LEE KYU HA

KR44 patents

⚠️ This page may combine multiple inventors who share the name “LEE KYU HA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KYU HA

SAMSUNG ELECTRONICS CO LTD

Method of fabricating multi-substrate semiconductor devices

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Cleaning robot and controlling method thereof

Semiconductor devices having through-vias and methods for fabricating the same

Electronic device having a redistribution area

Semiconductor device including through via structures and redistribution structures

Robot cleaner

Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices

Wafer loaders having buffer zones

Cleaning robot and method of controlling the same

Dishwasher

Semiconductor devices having through electrodes

Robot cleaner

Cleaning robot and controlling method thereof

Metal interconnection of a semiconductor device and method of manufacturing the same

Method for wafer planarization and an image sensor made by the same

Semiconductor devices having through-vias and methods for fabricating the same

Robot cleaner

Wafer carrier having cavity

SAMSUNG ELECTRO MECH

Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon

Multi-layered ceramic electronic component

Multilayer ceramic electronic component

Multilayer ceramic electronic component

Multilayer ceramic electronic component and method of manufacturing the same

Ceramic electronic component and method of manufacturing the same

Multilayer ceramic capacitor and board having the same mounted thereon

PARK MYUNG JUN

Multilayer ceramic electronic component

Multilayered ceramic electronic component

Multilayer ceramic electronic component and fabrication method thereof

Multilayer ceramic electronic component and method of fabricating the same

LEE HO-JIN

Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices

Semiconductor devices having conductive via structures and methods for fabricating the same

Semiconductor devices including protected barrier layers

SAMSUNG THALES CO LTD

Digital sampling rate converter for compensation for drop of in-band signal

Block interpolation filter structure using lookup table

JEON BYUNG JUN

Multilayer ceramic electronic component and fabrication method thereof

Multilayer ceramic electronic component and fabrication method thereof

GU HYUN HEE

Multilayer ceramic electronic component and method of fabricating the same

Multilayer ceramic electronic component

CHOI JU-IL

Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same

Semiconductor device having through silicon via (TSV)

JEONG SEYOUNG

Methods of fabricating semiconductor devices

LEE KYU-HA

Method of manufacturing the semiconductor device