Inventor
JEON BYUNG JUN
KR28 patents
⚠️ This page may combine multiple inventors who share the name “JEON BYUNG JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
17 patentsUS9439301B2Sep 6, 2016
Multilayered chip electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations84
US9318264B2Apr 19, 2016
Multilayer ceramic device
SAMSUNG ELECTRO MECH6 citations71
US9190207B2Nov 17, 2015
Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layer
SAMSUNG ELECTRO MECH5 citations71
US9514884B2Dec 6, 2016
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH5 citations68
US12586729B2Mar 24, 2026
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US12537138B2Jan 27, 2026
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US12456579B2Oct 28, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US12340945B2Jun 24, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US9343232B2May 17, 2016
Conductive paste composition for external electrode and multilayer ceramic electronic component including the same
SAMSUNG ELECTRO MECH2 citations61
US9218909B2Dec 22, 2015
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations61
US9082557B2Jul 14, 2015
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations61
US12462981B2Nov 4, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations52
US9514882B2Dec 6, 2016
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations52
US9305705B2Apr 5, 2016
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations52
US9673383B2Jun 6, 2017
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US12417882B2Sep 16, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations50
US9972439B2May 15, 2018
Ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations50
PARK MYUNG JUN
4 patentsUS8941972B2Jan 27, 2015
Multilayer ceramic electronic component
PARK MYUNG JUN9 citations83
US8842413B2Sep 23, 2014
Multilayered ceramic electronic component
PARK MYUNG JUN8 citations81
US8941971B2Jan 27, 2015
Multilayer ceramic electronic component and fabrication method thereof
PARK MYUNG JUN4 citations72
US8767375B2Jul 1, 2014
Multilayer ceramic electronic component and method of fabricating the same
PARK MYUNG JUN2 citations61