Inventor

CHEN CING HE

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHEN CING HE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US11728238B2Aug 15, 2023

Semiconductor package with heat dissipation films and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

TAIWAN SEMICONDUCTOR MFG

1 patent

US8945983B2Feb 3, 2015

System and method to improve package and 3DIC yield in underfill process

TAIWAN SEMICONDUCTOR MFG6 citations68