P

Inventor

MOLZER WOLFGANG

DE13 patents
⚠️ This page may combine multiple inventors who share the name “MOLZER WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

7 patents
US9564400B2Feb 7, 2017

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

INTEL CORP4 citations72
US9373588B2Jun 21, 2016

Stacked microelectronic dice embedded in a microelectronic substrate

INTEL CORP2 citations62
US12057411B2Aug 6, 2024

Stress relief die implementation

INTEL CORP0 citations61
US12538797B2Jan 27, 2026

Substrate for improved heat dissipation and method

INTEL CORP0 citations60
US12564058B2Feb 24, 2026

Packaging architecture with reinforcement structure in package substrate

INTEL CORP0 citations58
US12431424B2Sep 30, 2025

Buried power rails integrated with decoupling capacitance

INTEL CORP0 citations49
US12550736B2Feb 10, 2026

Packaging architecture with reinforcement structure in package substrate

INTEL CORP0 citations47

INFINEON TECHNOLOGIES AG

2 patents
US6750483B2Jun 15, 2004

Silicon-germanium bipolar transistor with optimized germanium profile

INFINEON TECHNOLOGIES AG5 citations62
US9583595B2Feb 28, 2017

Methods of forming low noise semiconductor devices

INFINEON TECHNOLOGIES AG0 citations47

MOLZER WOLFGANG

1 patent
US9252077B2Feb 2, 2016

Package vias for radio frequency antenna connections

MOLZER WOLFGANG32 citations90

INTEL IP CORP

1 patent
US9209143B2Dec 8, 2015

Die edge side connection

INTEL IP CORP5 citations72

APPLE INC

1 patent
US10845073B2Nov 24, 2020

Method and device for temperature control in a radio receiver

APPLE INC1 citations59

CALABRESE GIOVANNI

1 patent
US9171726B2Oct 27, 2015

Low noise semiconductor devices

CALABRESE GIOVANNI0 citations40