Inventor
CHAN YING-CHIH
TW8 patents
⚠️ This page may combine multiple inventors who share the name “CHAN YING-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
7 patentsUS9337136B2May 10, 2016
Method of fabricating a through-holed interposer
UNIMICRON TECHNOLOGY CORP4 citations83
US8981570B2Mar 17, 2015
Through-holed interposer, packaging substrate, and methods of fabricating the same
UNIMICRON TECHNOLOGY CORP3 citations62
US9408313B2Aug 2, 2016
Packaging substrate and method of fabricating the same
UNIMICRON TECHNOLOGY CORP2 citations61
US9111818B2Aug 18, 2015
Packaging substrate
UNIMICRON TECHNOLOGY CORP2 citations60
US9460992B2Oct 4, 2016
Packaging substrate having a through-holed interposer
UNIMICRON TECHNOLOGY CORP0 citations51
US9224683B2Dec 29, 2015
Method of fabricating packaging substrate having a through-holed interposer
UNIMICRON TECHNOLOGY CORP0 citations51
US9491871B2Nov 8, 2016
Carrier substrate
UNIMICRON TECHNOLOGY CORP0 citations40