Inventor
RAMALINGAM SHYAM
US11 patents
⚠️ This page may combine multiple inventors who share the name “RAMALINGAM SHYAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
8 patentsUS9099442B2Aug 4, 2015
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC4 citations83
US10546777B2Jan 28, 2020
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations72
US9911643B2Mar 6, 2018
Semiconductor constructions and methods of forming intersecting lines of material
MICRON TECHNOLOGY INC2 citations72
US9754825B2Sep 5, 2017
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC3 citations72
US11011420B2May 18, 2021
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations62
US10847442B2Nov 24, 2020
Interconnect assemblies with through-silicon vias and stress-relief features
MICRON TECHNOLOGY INC1 citations62
US9922875B2Mar 20, 2018
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations62
US9391001B2Jul 12, 2016
Semiconductor constructions
MICRON TECHNOLOGY INC0 citations51