Inventor

THACH SENH

US34 patents

⚠️ This page may combine multiple inventors who share the name “THACH SENH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

THACH SENH

APPLIED MATERIALS INC

Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination

Plasma-resistant ceramics with controlled electrical resistivity

System level in-situ integrated dielectric etch process particularly useful for copper dual damascene

Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate

Connectors for an electrostatic chuck and combination thereof

Single-body electrostatic chuck

Real time monitoring with closed loop chucking force control

Method and apparatus for thermal control of a semiconductor substrate

Low temperature aerosol deposition of a plasma resistive layer

Plasma-resistant, welded aluminum structures for use in semiconductor apparatus

Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas

Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus

High temperature electrostatic chuck bonding adhesive

Substrate support assembly having a plasma resistant protective layer

Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus

Pixilated cooling, temperature controlled substrate support assembly

Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods

Method of processing a substrate support assembly

Semiconductor processing apparatus including plasma-resistant, welded aluminum structures

Self-passivating plasma resistant material for joining chamber components

Electrostatic chuck with external flow adjustments for improved temperature distribution

Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods

SUN JENNIFER Y

Plasma resistant coatings for plasma chamber components

Method of producing a plasma-resistant thermal oxide coating

Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating

Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber

Clean, dense yttrium oxide coating protecting semiconductor processing apparatus

High temperature electrostatic chuck bonding adhesive

Wet clean process for recovery of anodized chamber parts

(unassigned)

Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers

Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber

High temperature electrical connector

BUSCHE MATTHEW J

Electrostatic chuck with external flow adjustments for improved temperature distribution

PARKHE VIJAY D

Electrostatic chuck with internal flow adjustments for improved temperature distribution