Inventor
LIN CHIA-YU
TW37 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIA-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COOLER MASTER CO LTD
10 patentsUS11402163B2Aug 2, 2022
Heat dissipation device and fin structure
COOLER MASTER CO LTD2 citations73
US11692777B2Jul 4, 2023
Heat exchanger fin and manufacturing method of the same
COOLER MASTER CO LTD2 citations72
US11530879B2Dec 20, 2022
Heat exchanger fin and manufacturing method of tHE same
COOLER MASTER CO LTD2 citations72
US12163745B2Dec 10, 2024
Heat dissipation device and fin structure
COOLER MASTER CO LTD0 citations62
US11725885B2Aug 15, 2023
Heat exchanger fin and manufacturing method of the same
COOLER MASTER CO LTD0 citations62
US11598588B2Mar 7, 2023
Method of manufacturing a heat exchanger
COOLER MASTER CO LTD0 citations62
US11598587B2Mar 7, 2023
Method of manufacturing a heat exchanger
COOLER MASTER CO LTD0 citations62
US11359870B2Jun 14, 2022
Method of manufacturing a heat exchanger
COOLER MASTER CO LTD0 citations62
US11732981B2Aug 22, 2023
Heat dissipation device
COOLER MASTER CO LTD0 citations59
US11384999B2Jul 12, 2022
Heat dissipation device
COOLER MASTER CO LTD0 citations59
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS12454455B2Oct 28, 2025
Semiconductor structure and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12054382B2Aug 6, 2024
Roughness selectivity for MEMS movement stiction reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11655138B2May 23, 2023
Roughness selectivity for MEMS movement stiction reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12283568B2Apr 22, 2025
Wafer bonding alignment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11742320B2Aug 29, 2023
Wafer bonding alignment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
LIN CHIA-YU
4 patentsUS9431271B2Aug 30, 2016
Heat dissipating device
LIN CHIA-YU3 citations71
US8853919B2Oct 7, 2014
Ultrasonic sensor device
LIN CHIA-YU5 citations66
US8164981B2Apr 24, 2012
Ultrasonic distance-measuring sensor with gap and partition between vibrating surfaces
LIN CHIA-YU0 citations48
US8919423B2Dec 30, 2014
Heat dissipating device
LIN CHIA-YU0 citations40
HIWIN TECH CORP
3 patentsTAIWAN GLASS IND CORP
3 patentsUS11713273B2Aug 1, 2023
Glass material with low dielectric constant and low fiberizing temperature
TAIWAN GLASS IND CORP0 citations50
US11345629B2May 31, 2022
Glass material with low dielectric constant attributable to high weight percentage of boron trioxide
TAIWAN GLASS IND CORP0 citations50
US11168016B2Nov 9, 2021
Glass material with low viscosity and low bubble content attributable to low weight percentage of silicon dioxide
TAIWAN GLASS IND CORP0 citations50
UNIV NAT CHENG KUNG
3 patentsUS11828754B2Nov 28, 2023
Modified electrode, manufacturing method thereof and use thereof
UNIV NAT CHENG KUNG0 citations47
US12435432B2Oct 7, 2025
Bismuth-based modified electrode, manufacturing method thereof and use thereof
UNIV NAT CHENG KUNG0 citations43
US11478176B2Oct 25, 2022
Miniature and intelligent urine sensing system
UNIV NAT CHENG KUNG0 citations41