Inventor
JANDZINSKI DAVID
US11 patents
⚠️ This page may combine multiple inventors who share the name “JANDZINSKI DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
6 patentsUS10882740B2Jan 5, 2021
Wafer-level package with enhanced performance and manufacturing method thereof
QORVO US INC25 citations93
US9960145B2May 1, 2018
Flip chip module with enhanced properties
QORVO US INC15 citations83
US10773952B2Sep 15, 2020
Wafer-level package with enhanced performance
QORVO US INC2 citations72
US10905007B1Jan 26, 2021
Contact pads for electronic substrates and related methods
QORVO US INC2 citations71
US11765826B2Sep 19, 2023
Method of fabricating contact pads for electronic substrates
QORVO US INC0 citations60
US10888040B2Jan 5, 2021
Double-sided module with electromagnetic shielding
QORVO US INC1 citations60
RF MICRO DEVICES INC
3 patentsUS9613831B2Apr 4, 2017
Encapsulated dies with enhanced thermal performance
RF MICRO DEVICES INC64 citations97
US10020206B2Jul 10, 2018
Encapsulated dies with enhanced thermal performance
RF MICRO DEVICES INC2 citations72
US10043707B2Aug 7, 2018
Additive conductor redistribution layer (ACRL)
RF MICRO DEVICES INC0 citations39