Inventor
Chadwick Jon
US13 patents
⚠️ This page may combine multiple inventors who share the name “Chadwick Jon”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
11 patentsUS10882740B2Jan 5, 2021
Wafer-level package with enhanced performance and manufacturing method thereof
QORVO US INC25 citations93
US9960145B2May 1, 2018
Flip chip module with enhanced properties
QORVO US INC15 citations83
US10773952B2Sep 15, 2020
Wafer-level package with enhanced performance
QORVO US INC2 citations72
US11069590B2Jul 20, 2021
Wafer-level fan-out package with enhanced performance
QORVO US INC1 citations62
US11063021B2Jul 13, 2021
Microelectronics package with vertically stacked dies
QORVO US INC0 citations62
US10486963B2Nov 26, 2019
Wafer-level package with enhanced performance
QORVO US INC1 citations61
US10804246B2Oct 13, 2020
Microelectronics package with vertically stacked dies
QORVO US INC0 citations52
US10804179B2Oct 13, 2020
Wafer-level package with enhanced performance
QORVO US INC0 citations51
US10755992B2Aug 25, 2020
Wafer-level packaging for enhanced performance
QORVO US INC0 citations51
US10490471B2Nov 26, 2019
Wafer-level packaging for enhanced performance
QORVO US INC0 citations51
US10109550B2Oct 23, 2018
Wafer-level package with enhanced performance
QORVO US INC0 citations47