Inventor

YU CHIA-LIN

TW39 patents

⚠️ This page may combine multiple inventors who share the name “YU CHIA-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU CHIA-LIN

YU CHEN-HUA

Light-emitting diodes on concave texture substrate

Light-emitting diodes on concave texture substrate

Light-emitting diode with textured substrate

Semiconductor package with through silicon vias

Through-silicon vias for semicondcutor substrate and method of manufacture

Light-emitting diode with textured substrate

Stress-alleviation layer for LED structures

Heat dissipation by through silicon plugs

Realizing N-face III-nitride semiconductors by nitridation treatment

III-V compound semiconductor epitaxy using lateral overgrowth

Group-III nitride for reducing stress caused by metal nitride reflector

Carbon-containing semiconductor substrate

TAIWAN SEMICONDUCTOR MFG

III-V compound semiconductor epitaxy from a non-III-V substrate

III-nitride based semiconductor structure with multiple conductive tunneling layer

Structure and method for a CMOS device with doped conducting metal oxide as the gate electrode

Realizing N-face III-nitride semiconductors by nitridation treatment

Through-silicon vias for semicondcutor substrate and method of manufacture

Method of manufacturing a semiconductor device including through silicon plugs

III-V compound semiconductor epitaxy from a non-III-V substrate

III-V compound semiconductor epitaxy from a non-III-V substrate

TAIWAN SEMICONDUCTOR MFG CO LTD

Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit

Method of making a semiconductor component having through-silicon vias

Method of manufacturing a semiconductor device including through silicon plugs

Semiconductor component having through-silicon vias

Semiconductor component having through-silicon vias and method of manufacture

Semiconductor component having through-silicon vias and method of manufacture

Method of manufacturing a semiconductor device including through silicon plugs

EPISTAR CORP

Light-emitting diodes on concave texture substrate

Light-emitting device

Light-emitting device including reflective layer

TSMC SOLID STATE LIGHTING LTD

Method of forming light-generating device including reflective layer

Light-emitting diode with textured substrate

WISTRON CORP

Clamping structure, electronic device and clamping component

Screwing accessory device

CHEN DING-YUAN

Reflective layer between light-emitting diodes

HORNG JAW-JUINN

Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit

YANG KU-FENG

Method for thinning a wafer

LIN CHENG-TUNG

MOSFETs having stacked metal gate electrodes and method

YU CHIA-LIN

III-nitride based semiconductor structure with multiple conductive tunneling layer