Inventor
SEIKE HIDEYUKI
JP10 patents
Patents
10 patentsUS9818736B1Nov 14, 2017
Method for producing semiconductor package
TDK CORP11 citations83
US9640500B2May 2, 2017
Terminal structure and semiconductor device
TDK CORP2 citations72
US9257402B2Feb 9, 2016
Terminal structure, and semiconductor element and module substrate comprising the same
TDK CORP3 citations72
US9070606B2Jun 30, 2015
Terminal structure and semiconductor device
TDK CORP2 citations62
US8933336B2Jan 13, 2015
Coating and electronic component
TDK CORP3 citations62
US10354973B2Jul 16, 2019
Method for producing semiconductor chip
TDK CORP0 citations51
US10163847B2Dec 25, 2018
Method for producing semiconductor package
TDK CORP0 citations51
US9177687B2Nov 3, 2015
Coating and electronic component
TDK CORP0 citations51
US8970037B2Mar 3, 2015
Terminal structure, and semiconductor element and module substrate comprising the same
TDK CORP0 citations51
US8787028B2Jul 22, 2014
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
TDK CORP0 citations51