Inventor
HORIKAWA YUHEI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “HORIKAWA YUHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
24 patentsUS9818736B1Nov 14, 2017
Method for producing semiconductor package
TDK CORP11 citations83
US9640500B2May 2, 2017
Terminal structure and semiconductor device
TDK CORP2 citations72
US9257402B2Feb 9, 2016
Terminal structure, and semiconductor element and module substrate comprising the same
TDK CORP3 citations72
US11869834B2Jan 9, 2024
Electroconductive substrate, electronic device and display device
TDK CORP1 citations71
US11031330B2Jun 8, 2021
Electroconductive substrate, electronic device and display device
TDK CORP3 citations71
US10867898B2Dec 15, 2020
Electroconductive substrate, electronic device and display device
TDK CORP3 citations71
US10374301B2Aug 6, 2019
Wiring component
TDK CORP4 citations71
US9070606B2Jun 30, 2015
Terminal structure and semiconductor device
TDK CORP2 citations62
US8933336B2Jan 13, 2015
Coating and electronic component
TDK CORP3 citations62
US11668008B2Jun 6, 2023
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
TDK CORP0 citations61
US11410855B2Aug 9, 2022
Method of producing electroconductive substrate, electronic device and display device
TDK CORP0 citations61
US10968519B2Apr 6, 2021
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
TDK CORP0 citations61
US10205250B2Feb 12, 2019
Junction structure for an electronic device and electronic device
TDK CORP0 citations52
US8976076B2Mar 10, 2015
High-frequency transmission line, antenna, and electronic circuit board
TDK CORP1 citations52
US10354973B2Jul 16, 2019
Method for producing semiconductor chip
TDK CORP0 citations51
US10163847B2Dec 25, 2018
Method for producing semiconductor package
TDK CORP0 citations51
US9177687B2Nov 3, 2015
Coating and electronic component
TDK CORP0 citations51
US8970037B2Mar 3, 2015
Terminal structure, and semiconductor element and module substrate comprising the same
TDK CORP0 citations51
US8787028B2Jul 22, 2014
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
TDK CORP0 citations51
US10784122B2Sep 22, 2020
Method of producing electroconductive substrate, electronic device and display device
TDK CORP0 citations50
US10304779B2May 28, 2019
Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
TDK CORP0 citations50
US11466368B2Oct 11, 2022
Sheet material, metal mesh and manufacturing methods thereof
TDK CORP0 citations44
US10392704B2Aug 27, 2019
Coating electronic component
TDK CORP0 citations42
US10354796B2Jul 16, 2019
Method for manufacturing planar coil
TDK CORP0 citations40