Inventor

ABE HISAYUKI

JP47 patents

⚠️ This page may combine multiple inventors who share the name “ABE HISAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ABE HISAYUKI

TDK CORP

Multilayer electronic part with planar terminal electrodes

Multilayer substrate and manufacturing method thereof

Soldering flux, solder paste and method of soldering

Non-magnetic ceramics and ceramic multilayer parts

Semiconductor package and manufacturing method therefor

Module with embedded semiconductor IC and method of fabricating the module

Method for producing semiconductor package

Stacked electronic part and method of manufacturing the same

Lead-free solder and electronic component built-in module

Terminal structure and semiconductor device

Magnetic head device

Terminal structure, and semiconductor element and module substrate comprising the same

Electroconductive substrate, electronic device and display device

Electroconductive substrate, electronic device and display device

Electroconductive substrate, electronic device and display device

Wiring component

Electronic component module

Terminal structure and semiconductor device

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

Method of producing electroconductive substrate, electronic device and display device

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

Mounting board and circuit board

Junction structure for an electronic device and electronic device

Rectifying component for magnetic disk device

Method for producing semiconductor chip

Method for producing semiconductor package

Electronic component

Terminal structure, and semiconductor element and module substrate comprising the same

Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure

Method of producing electroconductive substrate, electronic device and display device

Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof

Terminal structure, printed wiring board, module substrate, and electronic device

Sheet material, metal mesh and manufacturing methods thereof

Coating electronic component

Electronic circuit module component

Method for manufacturing planar coil

JVC KENWOOD CORP

Microphone for wireless communications device

Portable wireless communication device

SENJU METAL INDUSTRY CO

Thermosetting soldering flux and soldering process

TKD CORP

Method of producing a multilayer electronic part

TANIGUCHI SUSUMU

Ceramic electronic component

SAKURAI TAKASHI

Ceramic electronic component and method for producing same

KENWOOD CORP

Radio two-way communications device

ONODERA KO

Method for manufacturing electronic component

YOSHIDA KENICHI

Rare-earth sintered magnet containing a nitride, rotator containing rare-earth sintered magnet, and reciprocating motor containing rare-earth sintered magnet

SATO ATSUSHI

Plating film, printed wiring board, and module substrate

YASUI TSUTOMU

Lead-free solder and electronic component built-in module