Inventor
TAN ELLIOT N
US25 patents
⚠️ This page may combine multiple inventors who share the name “TAN ELLIOT N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
22 patentsUS10892223B2Jan 12, 2021
Advanced lithography and self-assembled devices
INTEL CORP11 citations86
US10211088B2Feb 19, 2019
Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects
INTEL CORP11 citations84
US9793159B2Oct 17, 2017
Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects
INTEL CORP13 citations84
US10409152B2Sep 10, 2019
Pattern decomposition lithography techniques
INTEL CORP4 citations83
US12218052B2Feb 4, 2025
Advanced lithography and self-assembled devices
INTEL CORP1 citations75
US11854787B2Dec 26, 2023
Advanced lithography and self-assembled devices
INTEL CORP1 citations73
US11373950B2Jun 28, 2022
Advanced lithography and self-assembled devices
INTEL CORP1 citations73
US10204830B2Feb 12, 2019
Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects
INTEL CORP3 citations73
US9659860B2May 23, 2017
Method and structure to contact tight pitch conductive layers with guided vias
INTEL CORP2 citations73
US9379010B2Jun 28, 2016
Methods for forming interconnect layers having tight pitch interconnect structures
INTEL CORP4 citations73
US11107786B2Aug 31, 2021
Pattern decomposition lithography techniques
INTEL CORP2 citations72
US10490519B2Nov 26, 2019
Pattern decomposition lithography techniques
INTEL CORP2 citations72
US12278204B2Apr 15, 2025
Pattern decomposition lithography techniques
INTEL CORP0 citations61
US12249541B2Mar 11, 2025
Vertical edge blocking (VEB) technique for increasing patterning process margin
INTEL CORP0 citations61
US12150297B2Nov 19, 2024
Thin film transistors having a backside channel contact for high density memory
INTEL CORP0 citations61
US12080781B2Sep 3, 2024
Fabrication of thin film fin transistor structure
INTEL CORP0 citations61
US11594448B2Feb 28, 2023
Vertical edge blocking (VEB) technique for increasing patterning process margin
INTEL CORP0 citations61
US10600678B2Mar 24, 2020
Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects
INTEL CORP0 citations52
US12446208B2Oct 14, 2025
Multilevel wordline assembly for embedded DRAM
INTEL CORP0 citations50
US11950407B2Apr 2, 2024
Memory architecture with shared bitline at back-end-of-line
INTEL CORP0 citations50
US12382721B2Aug 5, 2025
Integrated circuit structures having cut metal gates with dielectric spacer fill
INTEL CORP0 citations45
US10811351B2Oct 20, 2020
Preformed interlayer connections for integrated circuit devices
INTEL CORP0 citations41