Inventor
HIYAMA SHIN
JP11 patents
⚠️ This page may combine multiple inventors who share the name “HIYAMA SHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
4 patentsUS10763084B2Sep 1, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus
HITACHI INT ELECTRIC INC4 citations82
US10121651B2Nov 6, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations51
US10014171B2Jul 3, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations41
US10403478B2Sep 3, 2019
Plasma processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations40
KOKUSAI ELECTRIC CORP
4 patentsUS11101111B2Aug 24, 2021
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus
KOKUSAI ELECTRIC CORP3 citations71
US12505989B2Dec 23, 2025
Substrate processing apparatus, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations60
US11948778B2Apr 2, 2024
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations60
US11424146B2Aug 23, 2022
Substrate processing apparatus and temperature measurement unit
KOKUSAI ELECTRIC CORP0 citations50