Inventor
LEE HAEJIN
KR19 patents
⚠️ This page may combine multiple inventors who share the name “LEE HAEJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS10798849B2Oct 6, 2020
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD12 citations84
US11047628B2Jun 29, 2021
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD5 citations83
US11555657B2Jan 17, 2023
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD3 citations72
US11304337B2Apr 12, 2022
Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto
SAMSUNG ELECTRONICS CO LTD5 citations72
US11874471B2Jan 16, 2024
Electronic device including heat radiating member
SAMSUNG ELECTRONICS CO LTD4 citations71
US11632881B2Apr 18, 2023
Method for controlling cooling fan and wireless charging device
SAMSUNG ELECTRONICS CO LTD2 citations71
US11497141B2Nov 8, 2022
Heat dissipation device formed of nonmetallic material and electronic device including the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US10757846B2Aug 25, 2020
Electronic device including shielding member connected to conductive plate covering opening of shield can
SAMSUNG ELECTRONICS CO LTD5 citations71
US12238911B2Feb 25, 2025
Electronic device including sheilding structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US11098959B2Aug 24, 2021
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11895767B2Feb 6, 2024
Electronic device filled with phase change material between plurality of circuit boards connected by connecting members
SAMSUNG ELECTRONICS CO LTD1 citations60
US12317407B2May 27, 2025
Electronic device including printed circuit board structure including thermal interface material
SAMSUNG ELECTRONICS CO LTD0 citations59
US11503748B2Nov 15, 2022
Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11978950B2May 7, 2024
Electronic device including noise inducing structure
SAMSUNG ELECTRONICS CO LTD0 citations50
US12335424B2Jun 17, 2025
Electronic device including foldable display
SAMSUNG ELECTRONICS CO LTD0 citations45
US12278420B2Apr 15, 2025
Electronic device including mmWave antenna module
SAMSUNG ELECTRONICS CO LTD0 citations45