Inventor

CHANG TAI-MIN

TW21 patents

⚠️ This page may combine multiple inventors who share the name “CHANG TAI-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG TAI-MIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure having taper-shaped conductive pillar and method of forming thereof

Package structure having at least one die with a plurality of taper-shaped die connectors

Method for removing resist layer, and method of manufacturing semiconductor

Integrated circuit, package structure, and manufacturing method of package structure

Method for removing resist layer, and method of manufacturing semiconductor

Semiconductor structure and method of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of forming the same

Package structure including a die having a taper-shaped die connector

Packages with enlarged through-vias in encapsulant

Method for removing resistor layer, and method of manufacturing semiconductor

Integrated circuit, package structure, and manufacturing method of package structure

Packages with enlarged through-vias in encapsulant

Process including a re-etching process for forming a semiconductor structure

Packages with enlarged through-vias in encapsulant

Semiconductor package and manufacturing method thereof

Manufacturing method of package structure

Barrier layer for an interconnect structure

Semiconductor device structure and method for forming the same

Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer

WU YEWCHUNG SERMON

Thermal dissipation substrate