Inventor
EOFF JAMES DEAN
US9 patents
Patents
9 patentsUS11795569B2Oct 24, 2023
Systems for producing a single crystal silicon ingot using a vaporized dopant
GLOBALWAFERS CO LTD6 citations83
US10679908B2Jun 9, 2020
Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures
GLOBALWAFERS CO LTD7 citations78
US12595584B2Apr 7, 2026
Systems and methods for producing a single crystal silicon ingot using a vaporized dopant
GLOBALWAFERS CO LTD0 citations60
US12503790B2Dec 23, 2025
Systems and methods for producing a single crystal silicon ingot using a vaporized dopant
GLOBALWAFERS CO LTD0 citations60
US12270768B2Apr 8, 2025
Method of processing a cleaved semiconductor wafer
GLOBALWAFERS CO LTD0 citations60
US12019031B2Jun 25, 2024
Cleaved semiconductor wafer imaging system
GLOBALWAFERS CO LTD0 citations60
US11921054B2Mar 5, 2024
Cleaved semiconductor wafer camera system
GLOBALWAFERS CO LTD0 citations60
US10910280B2Feb 2, 2021
Methods for separating bonded wafer structures
GLOBALWAFERS CO LTD0 citations57
US11866844B2Jan 9, 2024
Methods for producing a single crystal silicon ingot using a vaporized dopant
GLOBALWAFERS CO LTD0 citations49