P

Inventor

MCCONNELL JOHN E

US40 patents
⚠️ This page may combine multiple inventors who share the name “MCCONNELL JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KEMET ELECTRONICS CORP

19 patents
US10707145B2Jul 7, 2020

High density multi-component packages

KEMET ELECTRONICS CORP24 citations93
US9793057B2Oct 17, 2017

Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond

KEMET ELECTRONICS CORP12 citations84
US9025311B1May 5, 2015

Very large ceramic capacitor with mechanical shock resistance

KEMET ELECTRONICS CORP10 citations84
US9748043B2Aug 29, 2017

Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors

KEMET ELECTRONICS CORP9 citations83
US9472342B2Oct 18, 2016

Leadless multi-layered ceramic capacitor stacks

KEMET ELECTRONICS CORP13 citations83
US9881744B2Jan 30, 2018

Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds

KEMET ELECTRONICS CORP3 citations73
US10068707B2Sep 4, 2018

Leadless multi-layered ceramic capacitor stacks

KEMET ELECTRONICS CORP2 citations72
US9805872B2Oct 31, 2017

Multiple MLCC modules

KEMET ELECTRONICS CORP5 citations72
US10381162B2Aug 13, 2019

Leadless stack comprising multiple components

KEMET ELECTRONICS CORP5 citations71
US11432448B2Aug 30, 2022

Method of forming an electronic device

KEMET ELECTRONICS CORP0 citations63
US10984955B2Apr 20, 2021

Electronic component structures with reduced microphonic noise

KEMET ELECTRONICS CORP1 citations62
US10366836B2Jul 30, 2019

Electronic component structures with reduced microphonic noise

KEMET ELECTRONICS CORP1 citations62
US11227719B2Jan 18, 2022

Leadless multi-layered ceramic capacitor stack

KEMET ELECTRONICS CORP0 citations61
US10729051B2Jul 28, 2020

Component stability structure

KEMET ELECTRONICS CORP0 citations52
US10757810B2Aug 25, 2020

High density multi-component packages

KEMET ELECTRONICS CORP0 citations51
US10790094B2Sep 29, 2020

Method of forming a leadless stack comprising multiple components

KEMET ELECTRONICS CORP0 citations50
US10229785B2Mar 12, 2019

Multi-layered ceramic capacitor with soft leaded module

KEMET ELECTRONICS CORP0 citations50
US10224149B2Mar 5, 2019

Bulk MLCC capacitor module

KEMET ELECTRONICS CORP0 citations41
US9357634B2May 31, 2016

Coefficient of thermal expansion compensating compliant component

KEMET ELECTRONICS CORP0 citations40

LEAR CORP

10 patents

MCCONNELL JOHN E

5 patents

LEAR AUTOMOTIVE DEARBORN INC

2 patents

BULTITUDE JOHN

2 patents

CHACKO ANTONY P

1 patent

GEN MOTORS CORP

1 patent