Inventor
MCCONNELL JOHN E
US40 patents
⚠️ This page may combine multiple inventors who share the name “MCCONNELL JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KEMET ELECTRONICS CORP
19 patentsUS10707145B2Jul 7, 2020
High density multi-component packages
KEMET ELECTRONICS CORP24 citations93
US9793057B2Oct 17, 2017
Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
KEMET ELECTRONICS CORP12 citations84
US9025311B1May 5, 2015
Very large ceramic capacitor with mechanical shock resistance
KEMET ELECTRONICS CORP10 citations84
US9748043B2Aug 29, 2017
Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
KEMET ELECTRONICS CORP9 citations83
US9472342B2Oct 18, 2016
Leadless multi-layered ceramic capacitor stacks
KEMET ELECTRONICS CORP13 citations83
US9881744B2Jan 30, 2018
Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds
KEMET ELECTRONICS CORP3 citations73
US10068707B2Sep 4, 2018
Leadless multi-layered ceramic capacitor stacks
KEMET ELECTRONICS CORP2 citations72
US9805872B2Oct 31, 2017
Multiple MLCC modules
KEMET ELECTRONICS CORP5 citations72
US10381162B2Aug 13, 2019
Leadless stack comprising multiple components
KEMET ELECTRONICS CORP5 citations71
US11432448B2Aug 30, 2022
Method of forming an electronic device
KEMET ELECTRONICS CORP0 citations63
US10984955B2Apr 20, 2021
Electronic component structures with reduced microphonic noise
KEMET ELECTRONICS CORP1 citations62
US10366836B2Jul 30, 2019
Electronic component structures with reduced microphonic noise
KEMET ELECTRONICS CORP1 citations62
US11227719B2Jan 18, 2022
Leadless multi-layered ceramic capacitor stack
KEMET ELECTRONICS CORP0 citations61
US10729051B2Jul 28, 2020
Component stability structure
KEMET ELECTRONICS CORP0 citations52
US10757810B2Aug 25, 2020
High density multi-component packages
KEMET ELECTRONICS CORP0 citations51
US10790094B2Sep 29, 2020
Method of forming a leadless stack comprising multiple components
KEMET ELECTRONICS CORP0 citations50
US10229785B2Mar 12, 2019
Multi-layered ceramic capacitor with soft leaded module
KEMET ELECTRONICS CORP0 citations50
US10224149B2Mar 5, 2019
Bulk MLCC capacitor module
KEMET ELECTRONICS CORP0 citations41
US9357634B2May 31, 2016
Coefficient of thermal expansion compensating compliant component
KEMET ELECTRONICS CORP0 citations40
LEAR CORP
10 patentsUS6608399B2Aug 19, 2003
Vehicle universal docking station and electronic feature modules
LEAR CORP289 citations98
US6423918B1Jul 23, 2002
Dome switch
LEAR CORP103 citations98
US7218745B2May 15, 2007
Headliner transducer covers
LEAR CORP24 citations91
US6181025B1Jan 30, 2001
Integral interrogator-coil circuit
LEAR CORP29 citations91
US7098411B1Aug 29, 2006
Electronic module for universal garage door opener and assembly method
LEAR CORP24 citations90
US7071434B1Jul 4, 2006
Button and light pipe mechanism and assembly
LEAR CORP27 citations90
US7458627B2Dec 2, 2008
Visor assembly incorporating an electronic control module
LEAR CORP9 citations84
US7760071B2Jul 20, 2010
Appliance remote control having separated user control and transmitter modules remotely located from and directly connected to one another
LEAR CORP6 citations72
US7256363B1Aug 14, 2007
Intermediate switch actuator array
LEAR CORP9 citations69
US7357647B1Apr 15, 2008
Assembly for controlling a device
LEAR CORP0 citations46
MCCONNELL JOHN E
5 patentsUS8988857B2Mar 24, 2015
High aspect ratio stacked MLCC design
MCCONNELL JOHN E22 citations90
US8902565B2Dec 2, 2014
Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
MCCONNELL JOHN E19 citations90
US9171672B2Oct 27, 2015
Stacked leaded array
MCCONNELL JOHN E19 citations89
US9779874B2Oct 3, 2017
Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
MCCONNELL JOHN E9 citations83
US8331078B2Dec 11, 2012
Leaded multi-layer ceramic capacitor with low ESL and low ESR
MCCONNELL JOHN E12 citations81