Inventor
CHEN KUO-CHING
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KUO-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
7 patentsUS11641713B2May 2, 2023
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US8049114B2Nov 1, 2011
Package substrate with a cavity, semiconductor package and fabrication method thereof
UNIMICRON TECHNOLOGY CORP6 citations57
US11488900B2Nov 1, 2022
Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same
UNIMICRON TECHNOLOGY CORP0 citations56
US12557219B2Feb 17, 2026
Circuit board structure and fabrication method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US12414235B2Sep 9, 2025
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US12396100B2Aug 19, 2025
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US11483925B2Oct 25, 2022
Circuit board and manufacture method of the circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
CHEN KUO-CHING
2 patentsVIA TECH INC
2 patentsUS7012926B2Mar 14, 2006
Packet receiving method on a network with parallel and multiplexing capability
VIA TECH INC14 citations82
US7689732B2Mar 30, 2010
Method for improving flexibility of arbitration of direct memory access (DMA) engines requesting access to shared DMA channels
VIA TECH INC8 citations77