Inventor
KUNIMUNE KOUICHI
JP28 patents
Patents
28 patentsUS5342739AAug 30, 1994
Method of preparing a negative pattern utilizing photosensitive polymer composition containing quinonediazide compound and a poly(amido)imide precursor
CHISSO CORP35 citations92
US5025088AJun 18, 1991
Photosensitive poly(amide)imide heat-resistant polymer
CHISSO CORP22 citations92
US4672099AJun 9, 1987
Soluble polyimide-siloxane precursor, process for producing same and cross-linked polyimide-siloxane
CHISSO CORP25 citations92
US5300627AApr 5, 1994
Adhesive polyimide film
CHISSO CORP21 citations91
US4818806AApr 4, 1989
Process for producing highly adherent silicon-containing polyamic acid and corsslinked silicon-containing polyimide
CHISSO CORP45 citations91
US4923968AMay 8, 1990
Melt-moldable crystalline polyimide polymer
CHISSO CORP21 citations81
US4864008ASep 5, 1989
Diamond compounds and liquid crystal aligning films
CHISSO CORP18 citations81
US5071908ADec 10, 1991
Silicon polyimide precursor composition
CHISSO CORP8 citations74
US6664021B1Dec 16, 2003
Photosensitive polymide precursor resin composition
CHISSO CORP8 citations73
US5589319ADec 31, 1996
Photosensitive polyimide resin composition
CHISSO CORP16 citations73
US5449588ASep 12, 1995
Photosensitive polyimide precursor composition with photoacid generator
CHISSO CORP9 citations73
US5449705ASep 12, 1995
Silicon-containing polyamic acid derivative and photosensitive resin composition using it
CHISSO CORP7 citations73
US5442024AAug 15, 1995
Photosensitive polyimide precursor composition
CHISSO CORP17 citations73
US5320935AJun 14, 1994
Method of forming a pattern from a photosensitive heat-resistant poly(amide)imide having hydroxyphenyl groups
CHISSO CORP6 citations73
US5084557AJan 28, 1992
Diamino compounds and liquid crystal aligning films
CHISSO CORP10 citations73
US5055549AOct 8, 1991
Process for preparing photosensitive heat-resistant polymer
CHISSO CORP7 citations73
US4970283ANov 13, 1990
Silicon-containing soluble polyimide precursor, its cured material, and method for preparing them
CHISSO CORP12 citations73
US4963635AOct 16, 1990
Processes for the production of silicon-containing polyimides precursors, and their cured polyimides low in hygroscopicity
CHISSO CORP12 citations73
US4959437ASep 25, 1990
Process for producing a low thermally expansive and highly adhesive silicon-containing polyimide and a precursor thereof
CHISSO CORP10 citations73
US4904758AFeb 27, 1990
Low-melting polyimide copolymer and method for preparing the same
CHISSO CORP17 citations73
US4656238AApr 7, 1987
Soluble polyimide-siloxane precursor, process for producing same, and cross-linked polyimide-siloxane
CHISSO CORP18 citations73
US4609700ASep 2, 1986
Soluble imide oligomer and a method for producing the same
CHISSO CORP9 citations73
US4591653AMay 27, 1986
Silicone-polyimide precursor and process for producing same
CHISSO CORP10 citations73
US5326792AJul 5, 1994
Polyimide photosensitive cover coating agent
CHISSO CORP9 citations70
US5473040ADec 5, 1995
Polyimidesiloxane film of low heat-conductivity
CHISSO CORP9 citations66
US5298359AMar 29, 1994
Photosensitive heat-resistant polymer having hydroxyphenyl group for forming a patterned image
CHISSO CORP4 citations62
US5294696AMar 15, 1994
Process for producing polyisoimide
CHISSO CORP3 citations62
US5026788AJun 25, 1991
Photosensitive polymer having thiol group
CHISSO CORP1 citations52