Inventor
NOJIRI HITOSHI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “NOJIRI HITOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KANEKA CORP
9 patentsUS6335416B1Jan 1, 2002
Polyimide film and process for producing the same
KANEKA CORP52 citations96
US7019104B1Mar 28, 2006
Diamine novel acid dianhydride and novel polyimide composition formed therefrom
KANEKA CORP19 citations92
US6605353B2Aug 12, 2003
Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
KANEKA CORP32 citations92
US6350845B1Feb 26, 2002
Polyimide compositions and novel acid dianhydrides to be used therein
KANEKA CORP17 citations92
US6307002B1Oct 23, 2001
Polyimide composition and process for producing the same
KANEKA CORP29 citations92
US6790930B1Sep 14, 2004
Process for producing polyimide resin
KANEKA CORP15 citations84
US6916393B2Jul 12, 2005
Multi-layered endless belt, medium conveying belt made of the same, production method thereof, and forming apparatus thereof
KANEKA CORP14 citations79
US6642393B2Nov 4, 2003
Acid anhydrides
KANEKA CORP6 citations74
US7662429B2Feb 16, 2010
Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same
KANEKA CORP1 citations52
KANEGAFUCHI CHEMICAL IND
8 patentsUS5932345AAug 3, 1999
Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same
KANEGAFUCHI CHEMICAL IND41 citations92
US4742099AMay 3, 1988
Polyimide film and process for producing same
KANEGAFUCHI CHEMICAL IND34 citations92
US5668247ASep 16, 1997
Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
KANEGAFUCHI CHEMICAL IND29 citations89
US4808468AFeb 28, 1989
Polyimide film and its manufacturing method
KANEGAFUCHI CHEMICAL IND8 citations67
US5167985ADec 1, 1992
Process for producing flexible printed circuit board
KANEGAFUCHI CHEMICAL IND3 citations63
US6689899B2Feb 10, 2004
Diamine and acid anhydride
KANEGAFUCHI CHEMICAL IND3 citations62
US5726281AMar 10, 1998
Epoxy-terminated polyamide, adhesive made therefrom and methods for producing them
KANEGAFUCHI CHEMICAL IND4 citations61
US5371175ADec 6, 1994
Epoxy-terminated polyamide, adhesive made therefrom and methods for producing them
KANEGAFUCHI CHEMICAL IND1 citations50