Inventor
LOFARO MICHAEL F
US41 patents
⚠️ This page may combine multiple inventors who share the name “LOFARO MICHAEL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS5609517AMar 11, 1997
Composite polishing pad
IBM160 citations99
US6348076B1Feb 19, 2002
Slurry for mechanical polishing (CMP) of metals and use thereof
IBM147 citations98
US6975032B2Dec 13, 2005
Copper recess process with application to selective capping and electroless plating
IBM85 citations97
US6475072B1Nov 5, 2002
Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)
IBM86 citations97
US5558563ASep 24, 1996
Method and apparatus for uniform polishing of a substrate
IBM97 citations96
US7064064B2Jun 20, 2006
Copper recess process with application to selective capping and electroless plating
IBM22 citations92
US6030275AFeb 29, 2000
Variable control of carrier curvature with direct feedback loop
IBM34 citations92
US6012968AJan 11, 2000
Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle
IBM46 citations92
US5618354AApr 8, 1997
Apparatus and method for carrier backing film reconditioning
IBM18 citations92
US5558111ASep 24, 1996
Apparatus and method for carrier backing film reconditioning
IBM41 citations92
US6325696B1Dec 4, 2001
Piezo-actuated CMP carrier
IBM50 citations91
US6199269B1Mar 13, 2001
Manipulation of micromechanical objects
IBM41 citations91
US6267659B1Jul 31, 2001
Stacked polish pad
IBM27 citations90
US6030487AFeb 29, 2000
Wafer carrier assembly
IBM22 citations87
US10247700B2Apr 2, 2019
Embedded noble metal electrodes in microfluidics
IBM15 citations85
US7022246B2Apr 4, 2006
Method of fabrication of MIMCAP and resistor at same level
IBM16 citations84
US10644233B2May 5, 2020
Combined CMP and RIE contact scheme for MRAM applications
IBM1 citations73
US10170361B2Jan 1, 2019
Thin film interconnects with large grains
IBM4 citations73
US10014464B1Jul 3, 2018
Combined CMP and RIE contact scheme for MRAM applications
IBM2 citations73
US9914118B2Mar 13, 2018
Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls
IBM2 citations73
US9804122B2Oct 31, 2017
Embedded noble metal electrodes in microfluidics
IBM5 citations73
US9782773B2Oct 10, 2017
Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls
IBM2 citations73
US10944044B2Mar 9, 2021
MRAM structure with T-shaped bottom electrode to overcome galvanic effect
IBM0 citations63
US9012329B2Apr 21, 2015
Nanogap in-between noble metals
IBM2 citations63
US6648979B2Nov 18, 2003
Apparatus and method for wafer cleaning
IBM6 citations58
US10236443B2Mar 19, 2019
Combined CMP and RIE contact scheme for MRAM applications
IBM0 citations52
US6098788AAug 8, 2000
Casting of complex micromechanical objects
IBM0 citations51
US7179760B2Feb 20, 2007
Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same
IBM1 citations49
US7955160B2Jun 7, 2011
Glass mold polishing method and structure
IBM1 citations48