Inventor
HSIEH CHANG-LIN
US16 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH CHANG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
10 patentsUS6949203B2Sep 27, 2005
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
APPLIED MATERIALS INC69 citations97
US6153530ANov 28, 2000
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion
APPLIED MATERIALS INC58 citations94
US6559942B2May 6, 2003
Monitoring substrate processing with optical emission and polarized reflected radiation
APPLIED MATERIALS INC63 citations93
US6905968B2Jun 14, 2005
Process for selectively etching dielectric layers
APPLIED MATERIALS INC27 citations92
US6607675B1Aug 19, 2003
Method of etching carbon-containing silicon oxide films
APPLIED MATERIALS INC29 citations92
US6547978B2Apr 15, 2003
Method of heating a semiconductor substrate
APPLIED MATERIALS INC26 citations92
US6455431B1Sep 24, 2002
NH3 plasma descumming and resist stripping in semiconductor applications
APPLIED MATERIALS INC24 citations92
US6897154B2May 24, 2005
Selective etching of low-k dielectrics
APPLIED MATERIALS INC12 citations79
US7071112B2Jul 4, 2006
BARC shaping for improved fabrication of dual damascene integrated circuit features
APPLIED MATERIALS INC3 citations55
US7585778B2Sep 8, 2009
Method of etching an organic low-k dielectric material
APPLIED MATERIALS INC0 citations42