Inventor
CHEN WEN-HWA
TW11 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WEN-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
4 patentsUS6034425AMar 7, 2000
Flat multiple-chip module micro ball grid array packaging
CHIPMOS TECHNOLOGIES INC26 citations90
US6023097AFeb 8, 2000
Stacked multiple-chip module micro ball grid array packaging
CHIPMOS TECHNOLOGIES INC24 citations90
US6781225B2Aug 24, 2004
Glueless integrated circuit system in a packaging module
CHIPMOS TECHNOLOGIES INC4 citations60
US6137174AOct 24, 2000
Hybrid ASIC/memory module package
CHIPMOS TECHNOLOGIES INC6 citations60