Inventor
INDYK RICHARD F
US24 patents
⚠️ This page may combine multiple inventors who share the name “INDYK RICHARD F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
20 patentsUS6139666AOct 31, 2000
Method for producing ceramic surfaces with easily removable contact sheets
IBM88 citations97
US6136419AOct 24, 2000
Ceramic substrate having a sealed layer
IBM74 citations95
US7724527B2May 25, 2010
Method and structure to improve thermal dissipation from semiconductor devices
IBM24 citations92
US7468886B2Dec 23, 2008
Method and structure to improve thermal dissipation from semiconductor devices
IBM21 citations92
US6312791B1Nov 6, 2001
Multilayer ceramic substrate with anchored pad
IBM36 citations92
US6187418B1Feb 13, 2001
Multilayer ceramic substrate with anchored pad
IBM40 citations92
US6261927B1Jul 17, 2001
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM16 citations84
US6258191B1Jul 10, 2001
Method and materials for increasing the strength of crystalline ceramic
IBM18 citations83
US5700549ADec 23, 1997
Structure to reduce stress in multilayer ceramic substrates
IBM16 citations81
US6597058B1Jul 22, 2003
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM12 citations73
US5755903AMay 26, 1998
Method of making a multilayer ceramic substrate having reduced stress
IBM14 citations73
US6955543B2Oct 18, 2005
Method and apparatus to form a reworkable seal on an electronic module
IBM11 citations72
US4663186AMay 5, 1987
Screenable paste for use as a barrier layer on a substrate during maskless cladding
IBM7 citations68
US7897059B2Mar 1, 2011
High tin solder etching solution
IBM4 citations63
US7087513B2Aug 8, 2006
Method to produce low strength temporary solder joints
IBM3 citations63
US11410894B2Aug 9, 2022
Polygon integrated circuit (IC) packaging
IBM1 citations62
US6823585B2Nov 30, 2004
Method of selective plating on a substrate
IBM2 citations60
US10134577B2Nov 20, 2018
Edge trim processes and resultant structures
IBM0 citations52
US6835260B2Dec 28, 2004
Method to produce pedestal features in constrained sintered substrates
IBM1 citations51
US10211175B2Feb 19, 2019
Stress-resilient chip structure and dicing process
IBM0 citations39
GLOBALFOUNDRIES INC
3 patentsUS10002835B2Jun 19, 2018
Structure for establishing interconnects in packages using thin interposers
GLOBALFOUNDRIES INC6 citations83
US9607973B1Mar 28, 2017
Method for establishing interconnects in packages using thin interposers
GLOBALFOUNDRIES INC10 citations83
US10090255B2Oct 2, 2018
Dicing channels for glass interposers
GLOBALFOUNDRIES INC6 citations71