Inventor

MATSUNAGA TETSUHIRO

JP7 patents

⚠️ This page may combine multiple inventors who share the name “MATSUNAGA TETSUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUNAGA TETSUHIRO

6 patents

US8497026B2Jul 30, 2013

Porous metal foil and production method therefor

MATSUNAGA TETSUHIRO3 citations59

US8187723B2May 29, 2012

Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer

MATSUNAGA TETSUHIRO4 citations58

US8304091B2Nov 6, 2012

Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof

MATSUNAGA TETSUHIRO1 citations49

US9595719B2Mar 14, 2017

Composite metal foil and production method therefor

MATSUNAGA TETSUHIRO1 citations48

US9512527B2Dec 6, 2016

Reinforced porous metal foil and process for production thereof

MATSUNAGA TETSUHIRO1 citations48

US8980438B2Mar 17, 2015

Porous metal foil and production method therefor

MATSUNAGA TETSUHIRO0 citations37

MITSUI MINING & SMELTING CO

1 patent

US7524552B2Apr 28, 2009

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

MITSUI MINING & SMELTING CO8 citations83