Inventor

SATO TETSURO

JP38 patents

⚠️ This page may combine multiple inventors who share the name “SATO TETSURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SATO TETSURO

MITSUI MINING & SMELTING CO

Resin-coated composite foil, production and use thereof

Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate

Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them

Multilayer printed wiring board and process for manufacturing the same

Multilayered printed wiring board and manufacturing method thereof

Resin-coated copper foil, and printed wiring board using resin-coated copper foil

Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method

Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer

Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer

MITSUI MINING & SMELTING CO LTD

Multilayer circuit board manufacturing method

Multilayer circuit board manufacturing method

Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board

Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor element

Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

Semiconductor package manufacturing method, and adhesive sheet used therein

Semiconductor package manufacturing method

Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor

SATO TETSURO

Friction stir welding apparatus comprising slide plates

Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer

Resin composition for forming insulating layer of printed wiring board

NIPPON SHARYO LTD

Railcar

Railcar

Fire-resistant floor structure of railroad vehicle

FUJI HEAVY IND LTD

System for damping lead-lag motion of rotor blades of helicopter

Flexbeam

SONY GROUP CORP

Information processing device and information processing method that enable simple calibration

Display control device, display control method, and recording medium

MATSUNAGA TETSUHIRO

Porous metal foil and production method therefor

Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof

PANASONIC IP MAN CO LTD

Wrinkle care support device and method for supporting wrinkle care

Makeup simulation assistance apparatus, makeup simulation assistance method, and non-transitory computer-readable recording medium storing makeup simulation assistance program

INT SUPERCONDUCTIVITY TECH

High temperature superconductor Josephson junction element and manufacturing method for the same

ASMO CO LTD

Retaining structure of brush spring of electric motor

CHEMO SERO THERAPEUT RES INST

Method of the production of immunoglobulin having high content of monomer

ZAIDANHOUZIN KASENZYOUHO SENTA

Videotext communication network with a receiving terminal that automatically preforms operations to network responsive to predetermined schedule

SONY CORP

Information processing device, information processing method, and program for generating an added related to a predicted future behavior

PANASONIC CORP

Transmission apparatus, reception apparatus, communication system, transmission method, and reception method

HITACHI METALS LTD

Communication light detector