Inventor
TRAN TU-ANH N
US14 patents
⚠️ This page may combine multiple inventors who share the name “TRAN TU-ANH N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
4 patentsUS7808117B2Oct 5, 2010
Integrated circuit having pads and input/output (I/O) cells
FREESCALE SEMICONDUCTOR INC12 citations79
US9368470B2Jun 14, 2016
Coated bonding wire and methods for bonding using same
FREESCALE SEMICONDUCTOR INC0 citations51
US9331046B2May 3, 2016
Integrated circuit package with voltage distributor
FREESCALE SEMICONDUCTOR INC0 citations46
US9257403B2Feb 9, 2016
Copper ball bond interface structure and formation
FREESCALE SEMICONDUCTOR INC0 citations43
TRAN TU-ANH N
4 patentsUS9437574B2Sep 6, 2016
Electronic component package and method for forming same
TRAN TU-ANH N3 citations71
US9780051B2Oct 3, 2017
Methods for forming semiconductor devices with stepped bond pads
TRAN TU-ANH N3 citations70
US9111755B1Aug 18, 2015
Bond pad and passivation layer having a gap and method for forming
TRAN TU-ANH N4 citations68
US8556159B2Oct 15, 2013
Embedded electronic component
TRAN TU-ANH N0 citations39
CARPENTER BURTON J
2 patentsUS9437459B2Sep 6, 2016
Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
CARPENTER BURTON J41 citations93
US9324675B2Apr 26, 2016
Structures for reducing corrosion in wire bonds
CARPENTER BURTON J0 citations51