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Inventor
HONG DAE Y
US
2 patents
Patents
2 patents
US6879028B2
Apr 12, 2005
Multi-die semiconductor package
FREESCALE SEMICONDUCTOR INC
15 citations
81
US7808117B2
Oct 5, 2010
Integrated circuit having pads and input/output (I/O) cells
FREESCALE SEMICONDUCTOR INC
12 citations
79