Inventor

KUAN HEAP HOE

SG142 patents

⚠️ This page may combine multiple inventors who share the name “KUAN HEAP HOE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUAN HEAP HOE

STATS CHIPPAC LTD

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Integrated circuit package system for electromagnetic isolation

Method of making a wafer level integration package

Embedded semiconductor die package and method of making the same using metal frame carrier

Package-on-package using through-hole via die on saw streets

Semiconductor package having through-hole via on saw streets formed with partial saw

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Integrated circuit package-in-package system with wire-in-film encapsulant

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof

Wafer level integration package

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Multi-chip package system

Same size die stacked package having through-hole vias formed in organic material

Integrated circuit package system with image sensor system

Semiconductor device and method of forming recessed conductive vias in saw streets

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Through-hole via on saw streets

Stackable integrated circuit package system with multiple interconnect interface

Integrated circuit package-on-package stacking system

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Integrated circuit package system with image sensor system

HUANG RUI

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Integrated circuit packaging system with package underfill and method of manufacture thereof

Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

CHOW SENG GUAN

Integrated circuit package system with internal stacking module

Integrated circuit package system with penetrable film adhesive

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Stackable integrated circuit package system

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

Integrated circuit package system with shield

DO BYUNG TAI

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Integrated circuit package system for shielding electromagnetic interference

Extended redistribution layers bumped wafer

Integrated circuit package system with warp-free chip

Package system for shielding semiconductor dies from electromagnetic interference

SHIM IL KWON

Integrated circuit packaging system with embedded circuitry and post

Embedded semiconductor die package and method of making the same using metal frame carrier

Integrated circuit packaging system with flex tape and method of manufacture thereof

Embedded semiconductor die package and method of making the same using metal frame carrier

PAGAILA REZA A

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Semiconductor device and method of shielding semiconductor die from inter-device interference

CHO NAMJU

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof