Inventor
HO TSZ YIN
HK10 patents
⚠️ This page may combine multiple inventors who share the name “HO TSZ YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
8 patentsUS6943057B1Sep 13, 2005
Multichip module package and fabrication method
STATS CHIPPAC LTD68 citations95
US7622325B2Nov 24, 2009
Integrated circuit package system including high-density small footprint system-in-package
STATS CHIPPAC LTD25 citations92
US7298038B2Nov 20, 2007
Integrated circuit package system including die stacking
STATS CHIPPAC LTD39 citations92
US7986043B2Jul 26, 2011
Integrated circuit package on package system
STATS CHIPPAC LTD11 citations84
US7619314B2Nov 17, 2009
Integrated circuit package system including die stacking
STATS CHIPPAC LTD7 citations73
US7981702B2Jul 19, 2011
Integrated circuit package in package system
STATS CHIPPAC LTD5 citations59
US7928564B2Apr 19, 2011
Multichip module package and fabrication method
STATS CHIPPAC LTD0 citations50
US7445955B2Nov 4, 2008
Multichip module package and fabrication method
STATS CHIPPAC LTD0 citations50