Inventor

MERILO DIOSCORO A

SG60 patents

⚠️ This page may combine multiple inventors who share the name “MERILO DIOSCORO A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MERILO DIOSCORO A

STATS CHIPPAC LTD

Stackable integrated circuit package system with multiple interconnect interface

Wirebondless wafer level package with plated bumps and interconnects

Integrated circuit package system employing device stacking

Integrated circuit package-on-package stacking system

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Integrated circuit package on package system

Embedded integrated circuit package system

Integrated circuit package system with package integration

Semiconductor package system with die support pad

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Integrated circuit package-on-package stacking system and method of manufacture thereof

Integrated circuit package system with interconnect lock

Quad flat pack in quad flat pack integrated circuit package system

Stackable integrated circuit package system

Integrated circuit package-on-package stacking system

Integrated circuit package in package system

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

CAMACHO ZIGMUND R

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Semiconductor device and method of forming wafer level multi-row etched lead package

Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP

Wafer level die integration and method

Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers

Semiconductor device and method of forming wafer level die integration

System and apparatus for wafer level integration of components

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Wirebondless wafer level package with plated bumps and interconnects

PAGAILA REZA A

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die

CAMACHO ZIGMUND RAMIREZ

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

Method for manufacturing semiconductor package system with die support pad

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

CHOW SENG GUAN

Stackable integrated circuit package system

Stackable integrated circuit package system with multiple interconnect interface

PAGAILA REZA ARGENTY

Integrated circuit packaging system with shielded package and method of manufacture thereof

RDL patterning with package on package system

KUAN HEAP HOE

Mountable integrated circuit package system with mountable integrated circuit die

Integrated circuit leaded stacked package system

ST ASSEMBLY TEST SERVICES LTD

Super thin/super thermal ball grid array package

ST ASSEMBLY TEST SERVICES PTE LTD

Super thin/super thermal ball grid array package

BATHAN HENRY DESCALZO

Integrated circuit packaging system with pad connection and method of manufacture thereof

ONG YOU YANG

Embedded integrated circuit package-on-package system

DAHILIG FREDERICK R

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die