Inventor
CHENG HSIEN-CHIE
TW5 patents
⚠️ This page may combine multiple inventors who share the name “CHENG HSIEN-CHIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
4 patentsUS7211886B2May 1, 2007
Three-dimensional multichip stack electronic package structure
IND TECH RES INST12 citations78
US10932361B2Feb 23, 2021
Circuit board and electronic device
IND TECH RES INST4 citations65
US7999350B2Aug 16, 2011
Electrode structure of memory capacitor
IND TECH RES INST3 citations59
US7378746B2May 27, 2008
Composite bump
IND TECH RES INST0 citations50