Inventor
LEE KYUWON
KR19 patents
⚠️ This page may combine multiple inventors who share the name “LEE KYUWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
5 patentsUS8004093B2Aug 23, 2011
Integrated circuit package stacking system
STATS CHIPPAC LTD37 citations91
US7683469B2Mar 23, 2010
Package-on-package system with heat spreader
STATS CHIPPAC LTD32 citations91
US9401347B2Jul 26, 2016
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
STATS CHIPPAC LTD5 citations83
US8932908B2Jan 13, 2015
Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
STATS CHIPPAC LTD5 citations82
US8937371B2Jan 20, 2015
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
STATS CHIPPAC LTD2 citations62
STATS CHIPPAC PTE LTD
3 patentsUS12211778B2Jan 28, 2025
Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure
STATS CHIPPAC PTE LTD0 citations60
US11764136B2Sep 19, 2023
Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure
STATS CHIPPAC PTE LTD0 citations60
US12525561B2Jan 13, 2026
Semiconductor device and method of forming dummy SOP within saw street
STATS CHIPPAC PTE LTD0 citations50
CHOI DAESIK
2 patentsKIM OHHAN
2 patentsKIM JINGWAN
2 patentsLEE KYUWON
2 patentsUS8288202B2Oct 16, 2012
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
LEE KYUWON2 citations57
US8502392B2Aug 6, 2013
Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die
LEE KYUWON0 citations46