Inventor

CHUN SUNYOUNG

KR5 patents

⚠️ This page may combine multiple inventors who share the name “CHUN SUNYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US8004093B2Aug 23, 2011

Integrated circuit package stacking system

STATS CHIPPAC LTD37 citations91

US8932908B2Jan 13, 2015

Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

STATS CHIPPAC LTD5 citations82

LEE KYUWON

2 patents

US8288202B2Oct 16, 2012

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

LEE KYUWON2 citations57

US8502392B2Aug 6, 2013

Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die

LEE KYUWON0 citations46

KIM JINGWAN

1 patent

US8432028B2Apr 30, 2013

Integrated circuit packaging system with package-on-package and method of manufacture thereof

KIM JINGWAN8 citations78