Inventor
CHAN KUEI-TI
TW9 patents
⚠️ This page may combine multiple inventors who share the name “CHAN KUEI-TI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
6 patentsUS9570399B2Feb 14, 2017
Semiconductor package assembly with through silicon via interconnect
MEDIATEK INC9 citations82
US12142633B2Nov 12, 2024
Semiconductor package with TSV inductor
MEDIATEK INC0 citations61
US11715754B2Aug 1, 2023
Semiconductor package with TSV inductor
MEDIATEK INC1 citations61
US9209148B2Dec 8, 2015
Semiconductor package
MEDIATEK INC2 citations61
US9548271B2Jan 17, 2017
Semiconductor package
MEDIATEK INC0 citations51
US9947624B2Apr 17, 2018
Semiconductor package assembly with through silicon via interconnect
MEDIATEK INC0 citations50