Inventor
VAUPEL MATHIAS
DE26 patents
⚠️ This page may combine multiple inventors who share the name “VAUPEL MATHIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
20 patentsUS8937380B1Jan 20, 2015
Die edge protection for pressure sensor packages
INFINEON TECHNOLOGIES AG9 citations76
US9748611B2Aug 29, 2017
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery
INFINEON TECHNOLOGIES AG4 citations73
US9448130B2Sep 20, 2016
Sensor arrangement
INFINEON TECHNOLOGIES AG6 citations73
US9366593B2Jun 14, 2016
Pressure sensor package with integrated sealing
INFINEON TECHNOLOGIES AG6 citations73
US10677675B2Jun 9, 2020
Pressure sensor module having a sensor chip and passive devices within a housing
INFINEON TECHNOLOGIES AG1 citations72
US10519030B2Dec 31, 2019
Transducer package with integrated sealing
INFINEON TECHNOLOGIES AG2 citations72
US10107867B2Oct 23, 2018
Sensor arrangement, battery cell and energy system
INFINEON TECHNOLOGIES AG3 citations72
US9013014B2Apr 21, 2015
Chip package and a method of manufacturing the same
INFINEON TECHNOLOGIES AG2 citations63
US11655143B2May 23, 2023
Semiconductor component and method for producing same
INFINEON TECHNOLOGIES AG0 citations62
US11287344B2Mar 29, 2022
Pressure sensor module having a sensor chip and passive devices within a housing
INFINEON TECHNOLOGIES AG0 citations62
US10947109B2Mar 16, 2021
Semiconductor component and method for producing same
INFINEON TECHNOLOGIES AG1 citations62
US10060819B2Aug 28, 2018
Pressure sensor module having a sensor chip and passive devices within a housing
INFINEON TECHNOLOGIES AG1 citations62
US8786085B2Jul 22, 2014
Semiconductor structure and method for making same
INFINEON TECHNOLOGIES AG0 citations51
US7989930B2Aug 2, 2011
Semiconductor package
INFINEON TECHNOLOGIES AG0 citations51
US8759207B2Jun 24, 2014
Semiconductor structure and method for making same
INFINEON TECHNOLOGIES AG0 citations49
US10781095B2Sep 22, 2020
Molded lead frame sensor package
INFINEON TECHNOLOGIES AG0 citations41
US9984927B2May 29, 2018
Method and apparatus for separating semiconductor devices from a wafer
INFINEON TECHNOLOGIES AG0 citations41
US9196535B2Nov 24, 2015
Method and apparatus for separating semiconductor devices from a wafer
INFINEON TECHNOLOGIES AG0 citations41
US9312226B2Apr 12, 2016
Semiconductor device having an identification mark
INFINEON TECHNOLOGIES AG0 citations39
US9147639B2Sep 29, 2015
Semiconductor dies having opposing sides with different reflectivity
INFINEON TECHNOLOGIES AG0 citations33