Inventor

REYNOLDS CHARLES L

US21 patents

⚠️ This page may combine multiple inventors who share the name “REYNOLDS CHARLES L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REYNOLDS CHARLES L

IBM

Multi terminal capacitor within input output path of semiconductor package interconnect

Ball grid array and land grid array assemblies fabricated using temporary resist

Ball grid array and land grid array assemblies fabricated using temporary resist

Decoupling capacitor stiffener

Thin film capacitors for core and adjacent build up layers

Carrier and integrated memory

Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method

Multicomponent module design and fabrication

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Ball grid array and land grid array assemblies fabricated using temporary resist

Multi terminal capacitor within input output path of semiconductor package interconnect

Multi terminal capacitor within input output path of semiconductor package interconnect

Multi terminal capacitor within input output path of semiconductor package interconnect

Carrier and integrated memory

Thin film capacitors for core and adjacent build up layers

Carrier and integrated memory

Carrier and integrated memory

Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system

CASEY JON ALFRED

Multi-chip module system with removable socketed modules