Inventor
HSIEH KUN-CHE
TW4 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH KUN-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
3 patentsUS9499399B2Nov 22, 2016
Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
UNITED MICROELECTRONICS CORP4 citations72
US8936960B1Jan 20, 2015
Method for fabricating an integrated device
UNITED MICROELECTRONICS CORP5 citations71
US10927000B2Feb 23, 2021
MEMS structure with an etch stop layer buried within inter-dielectric layer
UNITED MICROELECTRONICS CORP0 citations61