Inventor

LU CHUNG-YU

TW18 patents

⚠️ This page may combine multiple inventors who share the name “LU CHUNG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU CHUNG-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

Board substrates, three-dimensional integrated circuit structures and methods of forming the same

Three-dimensional integrated circuit structures and methods of forming the same

Semiconductor structure

Semiconductor packages and methods of forming same

Semiconductor structure and method for fabricating semiconductor structure

Semicondutor packages and methods of forming same

Semiconductor structure and method for fabricating semiconductor structure

Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof

Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof

Configurable routing for packaging applications

Methods of manufacturing a package

Methods and apparatus of packaging with interposers

Configurable routing for packaging applications

Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)

TAIWAN SEMICONDUCTOR MFG

Methods and apparatus for inductors and transformers in packages

Methods and apparatus of packaging with interposers

Methods and apparatus of packaging with interposers

UNIV NAT CHENG KUNG

Graft copolymer, process for producing the graft copolymer, process for preparing a gel polymer electrolyte including the graft copolymer, and intermediate copolymer of the graft copolymer