Inventor
DE SANTA MATTEO
IT7 patents
Patents
7 patentsUS10872845B2Dec 22, 2020
Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package
ST MICROELECTRONICS SRL2 citations69
US12575468B2Mar 10, 2026
Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package
ST MICROELECTRONICS SRL0 citations59
US11967544B2Apr 23, 2024
Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool
ST MICROELECTRONICS SRL0 citations59
US12406909B2Sep 2, 2025
Method of manufacturing semiconductor devices and corresponding semiconductor device
ST MICROELECTRONICS SRL0 citations53
US12506053B2Dec 23, 2025
Method of assembling semiconductor devices and corresponding semiconductor device
ST MICROELECTRONICS SRL0 citations51
US10741415B2Aug 11, 2020
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL0 citations48
US10141197B2Nov 27, 2018
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL1 citations48