Inventor
MAZZOLA MAURO
IT14 patents
⚠️ This page may combine multiple inventors who share the name “MAZZOLA MAURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS SRL
13 patentsUS6592352B1Jul 15, 2003
Offset edges mold for plastic packaging of integrated semiconductor devices
ST MICROELECTRONICS SRL18 citations82
US10872845B2Dec 22, 2020
Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package
ST MICROELECTRONICS SRL2 citations69
US7084003B2Aug 1, 2006
Method for manufacturing semiconductor device packages
ST MICROELECTRONICS SRL6 citations60
US12575468B2Mar 10, 2026
Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package
ST MICROELECTRONICS SRL0 citations59
US11967544B2Apr 23, 2024
Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool
ST MICROELECTRONICS SRL0 citations59
US12557669B2Feb 17, 2026
Method of manufacturing semiconductor devices, corresponding substrate and semiconductor device
ST MICROELECTRONICS SRL0 citations50
US12463170B2Nov 4, 2025
Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations
ST MICROELECTRONICS SRL0 citations50
US12456629B2Oct 28, 2025
Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die pad
ST MICROELECTRONICS SRL0 citations50
US11557547B2Jan 17, 2023
Leadframe for semiconductor devices, corresponding semiconductor product and method
ST MICROELECTRONICS SRL0 citations50
US5617295AApr 1, 1997
Leadframe for supporting integrated semiconductor devices
ST MICROELECTRONICS SRL0 citations50
US12538809B2Jan 27, 2026
Method of manufacturing semiconductor devices and corresponding semiconductor device
ST MICROELECTRONICS SRL0 citations48
US10741415B2Aug 11, 2020
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL0 citations48
US10141197B2Nov 27, 2018
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL1 citations48